NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is a ODISHA based PRIVATE LIMITED company, Registered at dated 04-FEB-2021 on Ministry of Corporate Affairs(MCA), The Corporate Identification Number (CIN) of NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is U45400OR2021PTC035524 and registration number is 035524.

It has been classified as COMPANY LIMITED BY SHARES and is registered under Registar of Companies CUTTACK India. Authorized share capital of NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is Rs. 100000 and its paid up capital is Rs. 10000. It aspire to serve in CONSTRUCTION activities across the India.

Its Annual General Meeting (AGM) was lastly conducted on and as per the records of Ministry of Corporate Affairs (MCA), its balance sheet was last filed on .

NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED has 2 directors SATYABRATA JENA, JAGANNATH PANI,

The registered Email address of NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED is satya.bjena@gmail.com and its registered address is PLOT NO 229/2494, BHIMPUR, UNIT-VI,BBSR, PS-CAPITAL KHURDA KHORDHA OR 751020 IN ODISHA ODISHA india 751020.

The current status of NEXT BONDING INFRATECH SOLUTION PRIVATE LIMITED shows as ACTIVE